Speakers

A Global Perspective

The executive summit delves into key topics such as emerging economic trends, disruptive technologies, market forecasts, and funding strategies. By exploring these areas, attendees will gain a deeper understanding of the market landscape and the implications for their business strategies. Moreover, they will gain valuable insights into how to navigate the complex funding landscape and capitalize on growth opportunities in the compound semiconductor, power electronics, and PICs industries.

If you are interested in speaking at the summit, please contact info@angel-tech.net or call +44 (0)24 7671 8970.

2024 Speakers Include

CSconnected
Earlybird
European Commission
Intralink Group
Knowmade
Pava Partners
Photonics21
SHP Law
TechTour
Yole Group

Summit Moderator

Michael Lebby
Lightwave Logic Inc

2024 Presentation Speakers

Economic Trends and Market Drivers

Reshaping the Landscape: Dynamics and Strategies in Wide Band-Gap Semiconductors

Presented by Poshun Chiu, Senior Analyst, Yole Group

Over recent years, the wide band-gap semiconductor landscape, particularly in Power SiC and GaN, has experienced noteworthy shifts with significant mergers, acquisitions, partnerships, and supply agreements. New entrants have intensified competition. Material suppliers are advancing into epiwafer and device realms, while some device manufacturers are integrating epiwafer or substrate internally. This dynamic raises questions about the motivations and strategies driving such decisions and prompts speculation about the future moves within the eco-system. This presentation by Yole Group aims to provide a comprehensive overview of market trends over the next five years, shedding light on the strategies employed by market players to reshape the supply chain.

Semiconductors in China: How to navigate a difficult market

Presented by Stewart Randall, VP, Director of Operations China - Head of Electronics and Embedded Software, Intralink Group

The Chinese semiconductor sector has been key for western firms for many years. However, in recent times, navigating the market has become increasingly difficult – and the media sometimes misrepresents the reality on the ground. While there are limitations on what western companies can do in China, there are still areas that are open to international businesses – and some areas where western sales are actually increasing. So, where are the main opportunities, and how should companies address them? What should your strategy be? And what are the best routes to market?

Staying ahead in the semiconductor game: on valuations, growth financing, and consolidation appetite of international buyers

Presented by Philipp Schlüter, Partner & M&A expert, Pava Partners

The semiconductor industry is booming, with fabs being built across the globe. This rapid growth is being driven by AI, communication, and automotive electronics. More than €45bn will be invested in new fabs in Europe. Nonetheless, growth funding is scarce in Europe. However, this offers a prime chance to sell a growing and profitable company, as buyers from Europe, the US and Asia are looking to further consolidate the market. Philipp Schlueter, an M&A advisor with focus on the semicon sector, will talk about valuations in the semicon and semicap market, growth financing, and the consolidation appetite of international buyers.

 
Funding Opportunities

Accelerated innovation meets favorable capital market cycle

Presented by Dr. Hendrik Brandis, Partner and Co-Founder, Earlybird

The mid- to long-term prospects for the European venture industry are determined by the fact that the growth of the demand for qualified venture capital funding is exponential and surpasses the more linear growth of venture capital supply. The key driver for this is the exponential growth of technology creation, while the VC supply tends to grow more linearly. In addition to this long-term trend, there are more short-term overlaying capital market cycles. These cycles induced a sharp downturn starting in the fall of 2021, reaching a bottom in 2023, and are now beginning to recover. The combination of these factors is expected to positively drive the venture markets in 2024 and 2025.

Initiatives for PIC pilot lines in Europe

Presented by Lutz Aschke, President Photonics21, Photonics21

The EU Chips Act aims at reinforcing the European semiconductor ecosystem and Europe's technological leadership. Within this context, also Photonic Integrated Circuits (PICs) play an important role as the varying underlying material systems each provide special advantages for the intended applications besides the general advantages of high power efficiency, speed, and bandwidth. The European Technology Platform Photonics21, representing the photonics community of industry and research organisations, has put forward a Joint White Paper on Integrated Photonics together with the European Association on Smart Systems Integration (EPoSS) to identify research, innovation, and industrialisation priorities for further strengthening Europe’s position in PICs. Furthermore, Photonics21 has integrated the topic into the Strategic Research and Innovation Agenda (SRIA) of the Photonics Partnership with the EC and handed over R&I priorities on PICs for the work programmes 2025-27. Additionally, Photonics21 supports the activities of PIC pilot lines within Europe in order to support integration into the Chips Joint Undertaking and its calls.

Paying for sovereign capability

Presented by Chris Meadows, Director, CSconnected

The battle for technological supremacy has in recent years taken centre stage as national governments look at geo-political dependencies that have created a desire to take control of the semiconductor technologies that are the fundamental building blocks that underpin so many aspects our everyday lives. Recent semiconductor shortages have brought a sharp focus to the need for significant strategic funding interventions in semiconductors bygovernments world-wide. Against the backdrop of the US CHIPS Act and the EU Chip Act, this session will look at the evolution of the CSconnected compound semiconductor cluster and the role of government strategy in creating and maintaining a landscape for encouraging the building of a thriving eco-system.

Scaling Deep Tech Companies and Investment

Presented by William Stevens, Managing Director, TechTour

Deep tech companies require significant ambition, scaling evidence and investments to win the competitive battle. Tech Tour animates deep tech investment and scaling platforms and deep dives into some of the do’s and don’ts for deep tech companies.

The EU Chips Act – towards more chip design and production in Europe

Presented by Werner Steinhögl, Head of Sector, European Commission

With the EU Chips Act the European Union will create together with the member states incentives to (1) increase the semiconductor production capacity, (2) provide funds to stimulate technology leadership, and (3) take measures to make the chip supply chains more robust. The talk will give the political context, point out opportunities for stakeholders/innovators and put photonic integrated circuits (PICs) into the perspective.

 
Intellectual Property, Patents, Mergers and Acquisitions

Leveraging IP competitive intelligence in the semiconductor industry

Presented by Paul Leclaire, Patent and Technology Analyst, Knowmade

In the fast-paced and highly competitive semiconductor industry, the strategic utilization of Intellectual Property (IP) competitive intelligence could emerge as a pivotal factor for success. Indeed, in most cases, patent analysis is used for legal purposes such as freedom to operate, evidence of use, and litigation. However, by scrutinizing competitors' patent portfolios it is also possible to identify technological roadmaps, marketing strategies, etc. while mitigating/evaluating risks. This talk will provide insights to how IP may be used to understand some emerging ecosystems (Power Electronics, SiC, GaN) and early detect new opportunities.

Presentation title to be confirmed

Presented by Robert Harrison, Partner, SHP Law

Awaiting presentation abstract.